Intel could return to Apple computers in 2027

Original Article ↗ Hacker News Discussion ↗

Headline & basic clarification

  • Commenters stress this is about Intel manufacturing Apple-designed ARM SoCs, not Macs “returning to Intel” x86.
  • Several call the headline semi-clickbait and note the underlying rumor is based on limited analyst info and prior reports that Apple is testing Intel’s 18A process.

Apple’s strategy & supplier leverage

  • Widely seen as Apple hedging against dependence on a single fab (TSMC), especially given Taiwan risk.
  • Dual sourcing is viewed as a way to keep prices down and negotiate better terms with TSMC.
  • Apple has a history of trialing multiple fabs (e.g., TSMC vs Samsung) and then dropping the weaker one; this is framed as trial production, not a done deal.
  • Some argue Apple prefers controlling key components via deep supplier commitments, not outright factory ownership; buying Intel fabs is seen as unlikely.

Intel’s foundry prospects & nodes

  • Debate over whether this would be a “win” for Intel: it would validate the foundry pivot, but Apple is a brutally tough customer and may leave little profit.
  • Commenters note Intel’s 18A yields are reportedly low; 14A is considered more strategically important but even riskier to commit to now.
  • There’s discussion of Intel’s past process leadership, its 10nm fiasco, late EUV investments, and whether it can realistically challenge TSMC again.
  • Some suggest Intel might succeed first on “good enough” rather than absolute cutting-edge nodes; others point to GlobalFoundries as a cautionary tale.

Industry impact & competition

  • A major Apple order could help Intel fund advanced nodes and threaten TSMC’s dominance, indirectly affecting AMD, Nvidia, and others who currently “ride” TSMC’s progress.
  • Others doubt Intel can unseat TSMC, citing TSMC’s track record, scale, and capital depth.

Security, geopolitics, and onshoring

  • Multiple comments link this to US and allied desire for onshore or friendly-nation supply of advanced chips and possibly security-critical components.
  • Some mention that even if security modules were onshore, compromise of main CPUs or fabs elsewhere would still be a core risk.

Logistics & packaging

  • Discussion notes chips could still be assembled in Asia; physically moving huge values of chips by air is seen as feasible.
  • Intel’s advanced packaging capabilities in the US and Malaysia are highlighted as another reason Apple and others might use Intel for final assembly.