Apple, Intel have reached preliminary chip-making deal

Why Apple Left Intel and x86 Context

  • Several comments stress Apple’s move to Apple Silicon was about x86 perf/watt and roadmap issues, not just “Intel bad.”
  • Intel’s fab delays (especially 10nm) kept x86 stuck on older nodes while ARM/iPhone chips advanced, contributing to x86 falling behind.
  • Apple wanted CPUs optimized for tight thermal envelopes and consistent mobile performance; Intel’s mobile and workstation chips often ran hot, needed loud cooling, and slipped schedules.

What the Deal Likely Is (and Isn’t)

  • Consensus: this is Intel Foundry manufacturing Apple‑designed chips, not Apple going back to Intel x86 CPUs.
  • Unclear which products are targeted; speculation ranges from support/low‑end chips (Watch, TV, entry iPads, low‑end Macs) to “main processors,” but no concrete detail.
  • Many expect Apple to keep flagship iPhone SoCs on TSMC for the foreseeable future.

Government Role and Industrial Policy

  • The thread highlights reporting that the U.S. government, now a major Intel shareholder, “played a major role” in bringing Apple to the table.
  • Some view this as coercive or stock manipulation; others frame it as normal industrial policy to secure domestic chip capacity and supply‑chain resilience.
  • Motivations mentioned include national security, military needs, and “digital sovereignty.”

Supply Chain, Capacity, and TSMC Dependence

  • Strong agreement that Apple wants to diversify away from a single advanced-node supplier (TSMC), especially given geopolitical risk around Taiwan.
  • TSMC advanced nodes are described as fully booked, with AI chips (Nvidia, AMD, Google, etc.) soaking up capacity and often offering higher margins than Apple’s devices.
  • Some argue Apple can no longer assume it will get all the cutting‑edge wafers it wants, prompting a hedge with Intel (and possibly Samsung).

Intel’s Technical and Business Trajectory

  • Several posts argue Intel is “back in the game” with nodes like 18A/14A and strong packaging/chiplet tech (Foveros, EMIB).
  • Others counter that Intel’s 18A efficiency is still behind TSMC’s best 3nm variants, citing benchmark analyses and debating how to fairly compare processes (single‑thread vs multi‑thread metrics).
  • Intel’s limited capacity and scaling challenges are seen as the main constraint, not just node competitiveness.
  • There’s discussion of Intel’s stock surge and the idea that Intel was effectively “not allowed to fail” due to its strategic role.

Implications for Apple Products and Users

  • Some hope this leads to more affordable Macs or expands mid‑range lines; others worry Intel‑fabbed Apple chips could be less efficient if Intel’s process lags TSMC.
  • Consensus that this doesn’t resurrect classic Boot Camp: Apple firmware, ARM architecture, and Microsoft’s licensing stance remain blockers.

Reaction to the Article and Coverage

  • Multiple commenters note the article is light on specifics, making firm conclusions about products or timelines “unclear.”
  • Paywall/adblock friction is discussed, with workarounds like reader mode mentioned.