Fake chips, I got stung
Counterfeit and relabeled integrated circuits are increasingly turning up in everything from retro-computing projects to industrial and even high‑reliability applications, with one hobbyist uncovering that “new old stock” 65C02 CPUs were actually older 6502 variants. Commenters describe how fake parts are harvested from e‑waste, re-marked with laser etching or fresh paint, and sometimes even sold by ostensibly reputable local resellers or large distributors, making visual inspection, electrical testing, and supply-chain traceability critical. The conversation ranges from the extreme validation practices in defense and industrial sectors to the limited economics of chip-forensics services and the practical advice to favor trusted distributors, while still testing parts whenever the risk of failure is high.
Character on the counterfeit chip
- Multiple attempts to identify the handwritten underside mark.
- Several Chinese speakers conclude it’s likely the character “贤”, rotated 90°, though others suggest “阮”, “防”, or even a non-character scribble.
- “贤” means “virtuous / worthy / able”; some speculate it’s a QA inspector’s name or mark, not a device status indicator.
Using and replacing 65C02s
- Suggestion to use newly manufactured WDC 65C02s from mainstream distributors; note that WDC is Western Design Center, not Western Digital.
- The original article’s adapter board for WDC’s different pinout is highlighted.
- Ongoing demand attributed largely to legacy industrial/embedded systems and reuse of existing codebases, not just hobbyists.
- Counterfeiters typically relabel older, cheaper 6502-family chips as newer or higher-spec variants rather than manufacture new silicon.
Why defense and high‑reliability sectors test so hard
- Detailed anecdotes of intense inbound QA: dimensional checks, sampling, and environmental testing even for “big vendor” parts.
- Reasons cited:
- Extreme operating conditions (temperature, vibration, radiation).
- Safety and mission-critical stakes.
- Risk of deliberate sabotage or hidden “easter eggs”.
- Need for consistent, traceable supply chains and post‑mortem analysis.
Counterfeit and mislabelled components in practice
- Many stories: fake or downgraded MOSFET drivers, NXP parts, USB–serial chips, CPUs, ADCs, and even completely dummy plastic packages.
- Most “fakes” described as lower‑grade/binned parts re-marked as higher‑spec, or pulled/failed parts reused.
- Some reports claim even large distributors have shipped suspect NXP parts; others strongly dispute this, citing lot traceability and never seeing it happen.
Detection, marketplaces, and sellers
- Visual cues: overly crisp laser markings, off logos, repainted packages, pins dipped in solder to look unused.
- Frustration with “local” eBay/UK sellers who actually import from China, sometimes ship via indirect logistics, and misrepresent origin.
- Libel risk in the UK is cited as a reason not to publicly name suspected bad sellers, though others do share specific listings.
- Common pattern in marketplaces: when caught, sellers often negotiate partial or full refunds without requiring returns.
Chip forensics and decapping services
- Decapping with acids to inspect die markings is described; hobbyist sites and commercial labs exist.
- Formal counterfeit‑detection and failure‑analysis services are available but expensive (thousands of dollars), making them impractical for cheap parts.